Define the ESD control program, incoming container, sealed-storage condition, dry or inert storage after opening when required, cleanliness, exposure time, pickup tool and permitted contact area. Active surfaces and air bridges may be fragile; orientation, backside condition and die-map identity need controlled inspection before attach. Record lot, wafer or trace code and reject any unidentified or damaged die.
Specify carrier or substrate, attach material and thickness, dispense or placement method, cure, void and planarity criteria. Control wire or ribbon material, diameter, bond method, pad sequence, loop height and length, RF ground bonds, spacing and pull or shear sampling. The interconnect parasitics and thermal path must match the model or be added to the design analysis.
Acceptance should link visual inspection, attach and bond records, assembly traveler, operator and equipment status, die identity, RF and DC test planes, fixture correction, raw results and pass limits. Define storage, rework and substitution rules plus change-notification and requalification triggers. A generic statement that the process is qualified does not establish acceptance for an exact die, assembly flow and RF configuration.